National Power & Signal Robotic Form in
Place Technologies
National Power & Signal offers automated dispensing for a
complete range of EMI compounds directly on to metal or non-metallic
housings, cover plates and any machined, cast or injection molded
parts that are used in medium to high volume applications. The multi
axis robotic systems can be programmed to apply a gasket bead as
small as 0.025” in diameter.
The automated dispensing technology has been designed to be
exceptionally cost effective combined with
fast prototyping and production deliveries. A shielding
effectiveness of up to 90 dB can be achieved within a frequency
range of 20 MHz to 10.0 GHz.
The conductive fillers used in silicone elastomers that are
available for automated gasket dispensing
are: Silver Plated Copper, Silver, Silver Plated Aluminum, Silver
Plated Glass, Silver Plated Nickel, Nickel Plated Graphite and Gold.
Primary benefits for the customer, The gasket material is dispensed directly onto the part or
substrate. Automated dispensing is suitable for all custom design applications.
It has proven to be an excellent alternative or replacement where
conventional die cut gasket technologies cannot be applied.
Hot Air Vulcanization Curing Process for Robotic Form in Place
Compounds that have been dispensed onto the substrate material.
National Power & Signal utilizes a series of specially designed
heat chambers to increase the cure time of the Form in Place
compounds.
|
Cure Time |
Temperature |
| 10 min. |
70* C |
| 7 min. |
75* C |
| 4 min. |
80* C |
| 3 min. |
90* C |
| 1 min. |
150* C |
National Power & Signal Conductive Compounds for Robotic Form in
Place Applications
Two component electrically conductive silicone materials are
filled with Silver Plated Copper or Nickel, Nickel Graphite and Gold
powder and an adhesive compound that is thermally and electrically
conductive.
The primary purpose of this material is for design requirements that
have the need for bonding, EMI shielding and environmental sealing.
These compounds have excellent electrical and thermal conductive
properties and low out gassing characteristics. These compounds have
been developed specifically for Robotic Form in Place applications.
